Data Center Flooring Systems

Liquid Cooling Solutions

Liquid Cooling Solutions

Modular underfloor manifolds are engineered to integrate seamlessly into raised flooring systems, allowing coolant to be routed efficiently beneath the surface without disrupting operations above the data hall. This underfloor approach enhances thermal performance for high-density environments while maintaining a clean and unobstructed layout for ongoing work. As AI and HPC workloads continue to drive unprecedented heat output, these manifolds provide a stable, efficient, and future-ready foundation for liquid cooling deployments.

Designed for speed and reliability, the manifolds arrive fully pre-assembled, pre-tested, and ready for installation. By shifting complexity off-site, the system reduces on-site labor demands, shortens installation windows, and mitigates project risk. Every manifold undergoes precise factory testing to ensure leak-free performance, consistent quality, and dependable operation from day one. This pre-engineered methodology enables teams to accelerate deployment schedules and maintain momentum on fast-tracked projects where timelines are compressed and uptime is critical.

Once installed, modular underfloor manifolds ensure optimal coolant distribution throughout the data hall, delivering precise thermal management to each equipment zone. The modular sections can be expanded or reconfigured as capacity grows, allowing facilities to scale and adapt without major rework or downtime. This built-in flexibility is essential for operators facing rapid hardware refresh cycles and increasing rack densities driven by next-generation compute.

With proven engineering, factory-controlled assembly, and repeatable modular precision, these systems empower data centers to scale intelligently. The result is faster deployment, higher operational efficiency, and more reliable performance across AI, HPC, and high-density compute environments. By combining quality assurance with installation efficiency and long-term adaptability, modular underfloor manifolds become a foundational component in building resilient, high-performance liquid cooling infrastructures.